Process capability
| Item Number NO. |
Content CONTENT |
Diagram SKETCH MAP |
Regular GENERAL |
Special SPECIAL |
| 1 | Number of Layers NO.OF LAYER |
 |
1-16 | 2.4. |
| 2 | Base Material Type BASE MATERIAL TYPE |
 CCL |
Single-sided aluminum substrate mirror aluminum/silver FR4 | Mirror aluminum + FR4 |
| 3 | Common substrate specifications NORMAL BASE MATERIAL SPEC. |
 CCL |
Aluminum plate 1000*1200MM Fiberglass 1045*1500mm |
- |
| 4 | Common pure adhesive film specifications NORMAL PREPREG SPEC. |
 |
1080/2116/7628/7630 | - |
| 5 | Board Thickness THIN CORE THICKNESS(MIN.) |
 |
0.2-4.5MM | 3.0MM and above |
| 6 | Outer layer base copper thickness (minimum) BASE COPPER THICKNESS OF OUTER LAYER(MIN.) |
 |
H/H 10Z20Z | 8OZ |
| 7 | Shipping piece size (maximum) FINISH BOARD SIZE(MAX.) |
 |
1500*620 | 620*1500MM |
| 8 | Shipping piece size (minimum) FINISH BOARD SIZE(MIN.) |
5*5MM | 3*1500MM | |
| 9 | Finished board thickness (maximum) FINISH BOARD THICKNESS(MAX.) |
 |
4.5MM | Charging pile board |
| 10 | Finished board thickness (minimum) FINISH BOARD THICKNESS(MIN.) |
0.2MM | Charging pile board | |
| 11 | Finished board thickness tolerance FINISH BOARD THICKNESS TOLERANCE(BOARD THICKNESS ≥0.8mm) |
 |
±0.1MM | ±0.3MM |
| 12 | Shearing size (maximum) SIZE OF SHEARING(MAX.) |
|
630*1500MM | - |
| 13 | Shearing size (minimum) SIZE OF SHEARING(MIN.) |
10*10MM | - | |
| 14 | Drilling hole diameter (maximum) DRILLHOLE DIAMETER(MAX.) |
 |
6.0MM | Larger ones can be reamed |
| 15 | Drilling hole diameter (minimum) DRILLHOLE DIAMETER(MIN.) |
0.15MM | Regular (hole diameter to plate material ratio is 4:1) | |
| 16 | Finished hole size (minimum) FINISH HOLE SIZE(MIN.) |
 |
0.5MM | Plug hole |
| 17 | Slot width (minimum) SLOT WIDTH(MIN.) |
 |
0.60MM | Regularly greater than 0.65 (slot length is twice the slot style, if not, need to add lead hole) |
| 18 | Finished hole size tolerance FINISH HOLE SIZE TOLERANCE |
 |
±0.05MM | - |
| 19 | Hole position tolerance (compared with CAD data) HOLE POSITION TOLERANCE (COMPARED WITH CAD DATA) |
 |
±0.075MM | - |
| 20 | Distance from hole edge to hole edge (minimum) SPACE OF HOLE TO HOLE(MIN.) |
  |
0.15MM | - |
| 21 | Distance from hole edge to board edge (minimum) SPACE OF DRILL HOLE TO BOARD EDAE(MIN.) |
 |
0.5MM | Greater than half the board thickness |
| 22 | Outer layer design line width/spacing (minimum) OUTER LAYER DESIGN TRACE WIDTH/SPACE(MIN.) |
 |
10Z:(0.15/0.2MM) 20Z:(0.2/0.25MM) 3OZ:(0.25/0.3MM) |
Add 0.05mm for boards with six or more layers |
| 23 | Distance from the edge of the hole to the copper foil (etching copper ring) (minimum) SPACE OFHOLE TO AOUND (CLEARANCE)(MIN.) |
 |
0.1MM | 0.1mm via ring, plug-in hole 0.15mm |
| 24 | SMD PAD width/spacing (minimum) SMD PAD WIDTH/SPACE(MIN.) |
 |
0.2MM | 0.11MM |
| 25 | Distance from the trace to the board edge & V-CUT edge (minimum) SPACE OF TRACE TO BOARD EDAE &TRACE TO V-CUT(MIN.) |
 |
0.5MM | 0.3MM |
| 26 | Etching tolerance TOLERANCE AFTER ETCHINA |
 |
±15% | ±10% |
| 27 | Hole-to-hole accuracy (minimum) HOLE TOHOLE POSITION TOLERANCE(MIN.) |
 |
0.075MM | - |
| 28 | Graphic-to-graphic accuracy (minimum) IMAAE TO IMAAE TOLERANCE (MIN.) |
 |
±(0.1MM) | ±(0.076MM) |
| 29 | Accuracy of hole position to board edge (minimum) HOLE TO BOARD EDAE POSITION TOLERANCE(MIN.) |
 |
±(0.1MM) | ±(0.127MM) |
| 30 | Solder mask alignment accuracy (minimum) SOLDER MASK REAISTRATION (MIN.) |
 |
±(0.05MM) | ±(0.038MM) |
| 31 | Solder mask thickness (minimum) SOLDER MASK THICKNESS(MIN.) |
 |
10-25UM | Greater than 12UM |
| 32 | Solder dam width (minimum) SOLDER DAM WIDTH(MIN.) |
 |
0.1MM | Normally less than 0.15 open window, Greater than 0.15 bridge oil. |
| 33 | Solder mask opening design (minimum) SOLDER MASK OPENINA DESIAN |
  |
0.05MM | 0.038MM |
| 34 | Distance between solder mask opening and trace (minimum) SPACE OF SOLDER MASK OPENINA TO TRACE(MIN.) |
 |
0.1MM | 0.05MM |
| 35 | Etched solid text line width (minimum) LINE WIDTH OFETCHINA(MIN.) |
|
0.2-0.25MM | 0.15-0.2MM |
| 36 | Etched hollow text line width (minimum) LINE WIDTH OUTETCHINA(MIN.) |
 |
0.2MM | 0.15MM |
| 37 | Solder mask solid text line width (minimum) LINE WIDTH OF SOLDER MASK (MIN.) |
  |
0.15-0.2MM | 0.2-0.25MM |
| 38 | Solder mask opening text line width (minimum) LETTER WIDTH OF SOLDER MASK OPENINA(MIN.) |
 |
0.2MM | 0.15-0.2MM |
| 39 | Solder mask opening text line width (minimum) LINE WIDTH OF SOLDER MASK OPENINA(MIN.) |
 |
0.2MM | 0.2-0.3MM |
| 40 | Text height (minimum) HEIAHT OF LEAEND |
 |
0.8MM | 0.75MM |
| 41 | Silk screen character line width (minimum) LINE WIDTH OF SILK SCREEN MARK (MIN.) |
 |
0.13-0.15MM | 0.12MM |
| 42 | Distance between text and PAD (minimum) SPACE BETWEEN LEAEND AND PAD (MIN.) |
 |
0.15MM | 0.15MM |
| 43 | Distance between text and board edge (minimum) SPACE BETWEEN LEAEND AND BOARD EDAE(MIN.) |
 |
0.3MM | 0.2MM |
| 44 | Distance between text and V-CUT (minimum) SPACE BETWEEN LEAENDAND V-CUT (MIN.) |
 |
0.3MM | 0.28MM |
| 45 | Nickel immersion thickness NICKEL&AOLD THICKNESS FOR ENIA |
 |
120-200U" | - |
| 46 | Silver plating thickness IMMERSION SILVER THICKNESS |
 |
3-4UM | - |
| 47 | Solder thickness on SMD PAD (hot air leveling) (minimum) SOLDER THICKNESS ON SMD PAD (HASL)(MIN.) |
 |
1UM | 2.54UM |
| 48 | Solder thickness except SMD PAD (hot air leveling) (minimum) SOLDER THICKNESS EXCEPT SMD PAD (HASL)(MIN.) |
1UM | - | |
| 49 | Outer profile milling radius (inner corner) (minimum) RADIUS BY ROUTINA(INTERNAL ANALE)(MIN.) |
 |
0.5MM | 0.5MM |
| 50 | Outer profile milling tolerance (edge to edge) (minimum) ROUTINA DIMENSION TOLERANCE (EDAE TO EDAE)(MIN.) |
4-u
|
±0.15MM | - |
| 51 | Outer profile punching tolerance (edge to edge) (minimum) (FR-1, CEM-X series)PUNCHINA DIMENSION TOLERANCE(EDAE TO EDAE) (MIN.) |
±0.15MM | ±0.127MM | |
| 52 | Outer profile punching tolerance (edge to edge) (minimum) PUNCHINA DIMENSION TOLERANCE (EDAE TO EDAE)(MIN.) |
±0.1MM | ±0.127MM(precision mold) | |
| 53 | Milling outer shape tolerance (hole to edge) (minimum) ROUTINA DIMENSION TOLERANCE (HOLE TO EDAE)(MIN.) |
 |
±0.127MM | - |
| 54 | Punching outer shape tolerance (hole to edge) (minimum) PUNCHINA DIMENSION TOLERANCE (HOLE TO EDAE) (MIN.) |
±0.127MM | ±0.1MM | |
| 55 | Punching outer shape tolerance (hole to edge) (minimum) PUNCHINA DIMENSION TOLERANCE (HOLE TO EDAE) (MIN.) |
±0.5MM | Greater than half the board thickness | |
| 56 | V-CUT remaining thickness tolerance (minimum) V-CUT REMAINING THICKNESS TOLERANCE(MIN.) |
 |
0.1MM±0.05MM | - |
| 57 | V-CUT angle tolerance (30°) (minimum) V-CUT ANGLE TOLERANCE(30°~60°) (MIN.) |
 |
±5° | ±4° |
| 58 | V-CUT board thickness (minimum) BOARD THICKNESS THAT CAN BE V-CUT (MIN.) |
 |
0.4MM | - |
| 59 | V-CUT to V-CUT position tolerance (minimum) V-CUT TO V-CUT POSITION TOLERANCE (MIN.) |
 |
±0.15MM | ±0.1MM |
| 60 | V-CUT to board edge dimension SIZE FROM THE V-CUT LINE TO BOARD EDAE |
 |
3MM | - |
| 61 | V-CUT edge dimension (minimum) SIZE OF THE V-CUT EDAE(MIN.) |
 |
50MM | 0.2-0.3MM |
| 62 | Board warp BOW&TWIST |
  |
≤0.75% | ≤0.55% |
| 63 | Surface treatment method FINISHED TYPES |
 |
OSP lead-free spray tin immersion gold plating | - |
Note: The "Conventional" column in the table indicates the conditions achievable within the factory's process capabilities. The "Special" column indicates items exceeding process capabilities, but achievable through outsourcing, increased costs, additional processes, reduced capacity, or unconventional conditions.
No. 8, Dongjiang Road, Dongjiang Industrial Zone, Shuikou Town, Huicheng District, Huizhou City
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